Publication Articles
Sealing in Success: The Role of Perfluoroelastomer Seals in Advanced IC Production
With advanced IC processes using more aggressive chemistries and higher operating temperatures, performance requirements have become much more stringent for the sealing components and o-rings used within capital equipment. At stake is the productivity of entire multibillion-dollar wafer fabs. Read the complete article (PDF)
By Fred Freerks and Dalia Vernikovsky
From Future Fab International Issue 31
Setting Standards for Sealing
In chip production, every facet of the process is created and designed with the most sophisticated tools, the most amazing technology and the most advanced controls. Super-stringent requirements are applied to each of the fabrication steps, which are guarded with process definitions, controls and documentation that forbid any variation or anomaly. As semiconductor technologies continue to evolve to higher and higher levels, the bar is raised at every step. Read the complete article (PDF)
By Dalia Vernikovsky